First-Hand Information on the Latest Encoder iCs

iC-Haus continues live webinar series this fall
Following the successful launch of their live webinar series during the spring, iC-Haus invites you to join the new upcoming series this fall. In these application-oriented webinars, iC-Haus experts will present the current developments in encoder IC technology and demonstrate them live:

  1. High-Resolution Magnetic Absolute Position Encoders: Things to know about the iCMU
    Series (Tuesday, Oct. 05, 2021, 9:30 10:15 AM CET)
    Regardless of whether for linear or rotary applications, the iC-MU Series for off-axis
    scanning is perfectly suited for robotic and motor feedback systems, as well as
    wherever a hallow shaft robust absolute position sensor is required.
  2. Encoder Chips for Safety Applications: Safe Drives through Optical Twin-Scan
    Encoder iCs (Tuesday, Nov. 09, 2021, 9:30 10:00 AM CET)
    Both the iC-RZ and iC-RB chip series consist of safe optical twin-scan encoder iCs
    featuring a redundant safety channel. Due to this innovative twin design, the singlechip
    system meets the high redundancy requirements of functional safety concepts
    up to SIL3 or PLe.
    Further information and free registration at:
    The seminars will be held in English. They are aimed at all those who are interested in
    innovative position sensor technology and encoders and at those who want to optimally
    use the latest iC-Haus encoder chips for their own solutions. In the subsequent Q&A
    sessions, experts will answer individual questions from the chat room.

Introducing iC-Haus
iC-Haus GmbH is a leading, independent German manufacturer of standard iCs (ASSP) and
customized ASiC semiconductor solutions with worldwide representation. The company has
been active in the design, production, and sales of application-specific iCs for industrial,
automotive, and medical applications for more than 37 years.

The iC-Haus cell libraries in CMOS, bipolar, and BCD technologies are specifically suited to
realize the design of sensor, laser/opto, and actuator ASiCs, among others. The iCs are
assembled in standard plastic packages or using the iC-Haus chip-on-board technology to
manufacture complete microsystems, multichip modules, and optoBGA/QFN in conjunction
with sensors.
Further information is available at