November is Magnetic Sensing Month at Magnetics Magazine!
Stay tuned and check the website frequently for new updates on the latest technology for magnetic sensing.
Infineon Technologies has expanded its Xensiv 3D magnetic sensor family with a new extremely small model that opens up new options for design engineers working with very tight spaces. The chipmaker unveiled the new device at its in-house digital trade show Virtual Sensor Experience in July.
Suitable for industrial and consumer applications, the TLI493D-W2BW uses the company’s latest 3D Hall generation and is housed in an extremely small wafer-level package. Its footprint is 87 percent smaller and its height 46 percent less than previous comparable products, the company says.
Due to the small package, 1.13 mm x 0.93 mm x 0.59 mm, and low current consumption of 7 nA in power-down mode, the new magnetic sensor is also suitable for use in applications that previously used resistor-based or optical solutions. Magnetic sensors offer numerous advantages here, such as their high accuracy or robustness against dust and moisture. In addition, magnetic sensors are easier to assemble and offer more design options.
The low height is helpful in extremely space-critical applications such as BLDC commutation in micromotors or control elements such as joysticks or game consoles. It enables designs with double-sided PCBs or positioning of the sensor between two PCBs. This allows optimal use of the available space; for example, additional components can be placed above the sensor. Infineon has already begun series production of the device. See www.infineon.com/3dmagnetic.
