AVX Corp. has released its new TCN PulseCap series tantalum solid electrolytic chip capacitors, a polymer electrode version of AVX’s industry-favorite, high capacitance, and high energy TLN PulseCap series. Available in the same single, large, low-profile case size (EIA 7361-20) as its parent series, which enables a capacitance range spanning 220 µF to 1500 µF, the TCN PulseCap series capacitors feature undertab terminations for high volumetric efficiency and high PCB assembly density, in addition to a conductive polymer cathode for reduced ignition and low ESR. TCN PulseCap series capacitors are well suited for use as energy bank capacitors in solid state drives (eSSDs) and external hard disk drives (eHHDs), as well as for a wide range of wireless transmitters, including smart meters and smartcards.
“Featuring a low-profile 2 mm height and undertab terminations instead of solder joints on the side of the capacitor body, the new TCN PulseCap series tantalum chip capacitors enable high volumetric efficiency and PCB assembly density, making them well suited for applications that require both high energy and low profiles, such as eSSD and eHDD devices,” said Allen Mayar, product marketing manager at AVX.
Lead-free compatible and RoHS compliant, TCN PulseCap series capacitors are rated for -55°C to 85°C and 6.3 VDC or 16 VDC. The series also features ±20 percent capacitance tolerance and 0.1 CV DC leakage current, and is suitable for 3x reflow solder processing at 260°C. Lead time for the series is 8 to 12 weeks.
For more information about AVX’s TCN PulseCap Series tantalum solid electrolytic chip capacitors with undertab terminations and conductive polymer electrodes, click here.
