Today, electromagnetic compatibility is critical to the success of any electronic device. A new product only receives a CE mark and may only be sold if it does not emit unacceptable interference signals and its functionality is not affected by electromagnetic waves. Careful shielding is a basic requirement for EMC compliance.
In a recently released compendium, Würth Elektronik presents the basic principles and practice-oriented application examples for modern EMC shielding technologies: In “ABC of Shielding” five expert authors share their knowledge and experience in a concise and easy-to-understand format.
From theory to practice in four steps
The work by Antonio Alcarria, Victor Martinez, Dr. Adrian Suarez, Dr. Jorge Victoria, and Dr.-Ing. (Doctor of Engineering) Heinz Zenkner is divided into four sections:
- Basic principles: The first part focuses on the impact of PCB, housing, and system design on the shielding effectiveness, basic physical effects and parameters, as well as emission and immunity requirements. It also covers the relevant standards and how to meet them using shielding materials.
- Components: The second part of the book describes various shielding materials and provides detailed characterization. The reader picks up valuable information on material compatibility, compression forces, and assembly.
- Applications: This chapter includes many specific examples of using various shielding materials, such as for shielding at the PCB level, wireless power supplies, as well as NFC and RFID applications.
- Tips for EMC shielding design: The final chapter provides a comprehensive overview with numerous specific examples for selecting and using shielding materials.
The “ABC of Shielding” reference guide, 1st edition, language: English, can be ordered directly from Würth Elektronik. It will also be available as an e-book from early 2025.
One of the largest European manufacturers of passive components and active in 50 countries, Würth Elektronik eiSos Group is a manufacturer of electronic and electromechanical components for the electronics industry. Production sites are located in Europe, Asia and North America.