In November 2024, iC-Haus based in Bodenheim, Germany, will present a broad portfolio of innovative IC and sensor products at two major trade shows. From November 12th to 14th, 2024, the experts from iC-Haus will be available for discussions and product presentations at the SPS – smart production solutions 2024 in Nuremberg, booth 4A-146. In addition from November 12th to 15th, a separate trade show team awaits visitors at electronica 2024 in Munich, stand B4-420.
What product highlights will iC-Haus be presenting in Nuremberg and Munich? In addition to proven standard products, a selection of product upgrades and latest generations will be presented:
- iC-GI22: the new two-channel inductive signal demodulator as a space-saving front-end chip for analysing inductive position sensors.
- Product innovation: iC-HSB laser driver: Extension of the iC-HS series of ultrashort pulse laser drivers with support for green, blue and UV laser diodes for TOF measurements, LiDAR, 3D scanning and spectroscopy.
- iC-PXL3212: the optically reflective 2-channel digital/analogue encoder for linear and rotary applications with integrated HD phased array photosensors and blue LED chip.
- iC-PNE + iC-MNF: the latest generation of optical phased arrays with significantly improved servo feedback.
- High-resolution reflective absolute encoders of the iC-PZ series and the iC-PVL magnetic multiturn IC for measuring multiturns on and off axis.
Visit the company’s website at https://www.ichaus.de/trade-shows/ to find out more.
Introducing iC-Haus
iC-Haus GmbH is a leading, independent German manufacturer of standard iCs (ASSP) and customized ASiC semiconductor solutions with worldwide representation. The company has been active in the design, production, and sales of application-specific iCs for industrial, automotive, and medical applications for 40 years. The iC-Haus cell libraries in CMOS, bipolar, and BCD technologies are specifically suited to realize the design of sensor, laser/opto, and actuator ASiCs, among others. The iCs are assembled in standard plastic packages or using the iC-Haus chip-on-board technology to manufacture complete microsystems, multichip modules, and optoBGA/QFN in conjunction with sensors.
Further information is available at http://www.ichaus.de.
