MCU

Utilizing its proprietary MagPack integrated magnetic packaging technology, Texas Instruments has introduced a series of six new power modules designed to improve power density, enhance efficiency and reduce EMI. TI engineers have shrunk the size of the modules by up to 23% compared to other modules and up to 50% smaller than their previous models, enabling designers of industrial, enterprise and communications applications to achieve previously impossible performance levels. Three of the six new devices rank as the smallest 6A power modules available, supplying an industry-leading power density of nearly 1A per 1mm2 of area, said TI. […]