Magnetic sensor ICs have become essential to modern electronics, enabling accurate detection of position, speed, current and orientation. Among them, tunnel magnetoresistance (TMR) sensors stand out for their high sensitivity, low power consumption and seamless fabrication compatibility. Over the past decade, they have moved from research prototypes to large-scale adoption. Their growing complexity requires precise wafer-level control of 3D magnetic fields in terms of orientation, magnitude and uniformity, creating new technical and throughput challenges for sensor manufacturers and test equipment suppliers.
As TMR sensor designs evolve toward higher performance and greater sensitivity, they require testing up to magnetic saturation along all spatial directions, a capability that existing wafer-level systems have been challenged to provide. Answering the call, magnetic test equipment maker Hprobe has introduced a new magnetic test instrument dedicated to wafer-level testing of the latest generation of TMR sensors under 3D magnetic field conditions. The H3DM-XLL combines extreme magnetic field capability with precise and quick 3D vector control, providing reliable and repeatable characterization across the full operating range of today’s advanced TMR devices.
“With this new product, Hprobe is making a major breakthrough in magnetic field capabilities for wafer-level testing of magnetic sensors,” said Dr. Siamak Salimy, Founder and CTO. “This development is the result of close collaboration with TMR sensor manufacturers. Several technical challenges have been resolved to tailor this new 3D magnetic generator specifically for the most advanced TMR sensor technologies.”
As the newest member of Hprobe’s 3D magnetic generator family, the H3DM-XLL enables vectorial magnetic field generation above 200 millitesla (mT) in any direction of space, reaching over 500 mT in-plane and more than 250 mT out-of-plane, on a large uniform area. These capabilities make it the only commercial solution providing such high field strength and full 3-axis vector control for wafer-level testing and characterization of magnetic sensors.
Founded in March 2017 and headquartered in Grenoble, France, Hprobe is a spin-off from SPINTEC—one of the world’s leading spintronics research laboratories. In March 2025, it was acquired by Mycronic, a publicly traded Swedish high-tech company specializing in precision production equipment for the electronics industry. Now it operates as part of Mycronic’s Global Technologies division.
“Mycronic has identified wafer and semiconductor tests as an attractive expansion area. Hprobe fits very well into this space with its unique technology, where a strong magnetic field is generated quickly over a large area. Hprobe has the potential of turning into a critical supplier for the MRAM test market. AI, VR, AR and the automotive industry all constitute emerging growth opportunities for Hprobe, and through their solutions, Mycronic can participate in this exciting development”, says Magnus Marthinsson, Senior Vice President Global Technologies at Mycronic.
“Joining Mycronic marks a significant milestone for Hprobe. This acquisition will enable us to scale operations, accelerate innovation, and better serve our customers worldwide,” said Laurent Lebrun, CEO of Hprobe. “With Mycronic’s global reach and resources, we are well-positioned to drive the future of magnetic device testing. Together, we will advance MRAM and sensor testing to support industry growth.”
For more info, see www.hprobe.com, www.mycronic.com.
